The fabs themselves aren’t the only limiting factor on modern lithography, skill is the bigger one; this stuff is probably more complicated than rocket science. We US engineers dont have the skills to run a competitive fab in the US, that takes many years of losing money to be developed. Intel has bigger better EUV machines than TSMC but they just cant compete and intel keeps laying off their engineers constantly which is a very bad signal.

Also, last time I was reading on the topic TSMC doesn’t plan to produce advanced chips on their US fabs to gatekeep their knowledge.

hes draining the swamp to build his custom swamp resort with wraiths and hookers.